Item
|
Conditions
|
Test result
|
Resistance
test per bump
|
Normal
temperature/Normal humidity
|
6 m¥Ø max.
|
Temperature
and humidity cycle test
|
-55¡ÆC to
125¡ÆC, 1000 cycles
|
Resistance
change rate within 10%
|
High-temperature
retention test
|
85¡É, 1,000 h
|
Resistance
change rate within 10%
|
Low-temperature
retention test
|
-40¡É, 1,000 h
|
Resistance
change rate within 10%
|
High-temperature
constant-humidity test
|
85¡É, 90% (RH), 1,000 h
|
Resistance
change rate within 10%
|
Ion
migration test
|
40¡É, 90% (RH), 60 VDC, 1,000 h
|
No
abnormality
|
Copper foil
pull-off strength test
|
90 peels
(copper thickness: 35 ¥ìm)
|
0.8kN/m
min.
|
Soldering
heat resistance test
|
260¡É, 20S
|
No
abnormality
|
Inductance
(1 GHz)
|
Bridge
method
|
2.8
|
Dielectric
loss tangent (1 GHz)
|
Bridge
method
|
0.0025
|
Water
absorption rate
|
23¡É, 24 h
|
0.04% max.
|
Thermal
expansion coefficient
|
Thermomechanical
analysis (TMA)
|
Vertical
direction: 17 ppm
|
¡¡
|
¡¡
|
Lateral
direction: 17 ppm
|