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0.3mm Pitch
0.3mm Pitch
NP584 Series, IC564 Series, IC561 Series
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IC564 series



IC564シリーズ

Features

●Solution for high mix low volume production
●High reliable contact pin technology
●Pitch from 0.30mm (suitable to none standard or staggered pitch)
●PKG size from 2.00 to 10.00 SQ 
●PKG suitability: BGA/LGA/QFN/SON 

Specifications

Specifications
Insulation Resistance1,000MΩmin. at 100V DC
Dielectric Withstanding Voltage100V AC for 1 minute
Contact Resistance (initial)500mΩmax. at 10mA max.
Operating Temperature Range-40℃ to +150℃
Material
HousingPEI, glass-filled
PES, glass-filled
Contacts, PlatingBeCu, Gold over Nickel


Applicable Dimensions(Reference only)

IC564シリーズ









IC561series

IC561シリーズ

Features

●Solution for high mix low volume production
●High reliable contact pin technology
●Pitch from 0.3mm (suitable to none standard or staggered pitch)
●PKG size from 2.00 to 18.00 SQ
●PKG suitability: BGA/LGA/QFN/SON

Specifications

Specifications
Insulation Resistance1,000MΩmin. at 100V DC
Dielectric Withstanding Voltage100V AC for 1 minute
Contact Resistance (initial)500mΩmax. at 10mA max.
Operating Temperature Range-40℃ to +150℃
Material
HousingPEI, glass-filled
PES, glass-filled
Contacts, PlatingBeCu, Gold over Nickel

Applicable Dimensions(Reference only)

IC561シリーズ