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IC307 Series |
0.8mm Pitch Production IC Sockets for FLGA |
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Features
・Designed for surface mounting ・High contact reliability with gold plating ・One-touch IC insertion ・Complete with IC removal fixture ・Suitable for automated assembly ・RoHS compliant
Product Specifications
Product Specifications |
Title |
Requirement |
Insulation Resistance |
100M¥ØMin. |
Withstanding Voltage |
150V AC rms / minute |
Contact Resistance |
50£í¥ØMax. |
Current Rating |
0.5A |
Operating Temperature |
-55¡É to +85¡É | |
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Product NameList
Product Name |
Applicable Package |
Pitch |
Number of Pins (Contacts) |
PCB mounting method |
Plating |
Connector Types |
Remarks |
IC307-088-1000 |
LGA |
0.8mm |
88 |
SMT |
Gold plating |
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FUJITSU DEVICES INC. NVPROM MSP88LV020 |
IC307-088-1001 |
LGA |
0.8mm |
88 |
SMT |
Gold plating |
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FUJITSU DEVICES INC. NVPROM MSP88LV020 |
IC307-TOOL-1-88 |
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TOOL |
IC insertion tool |
IC307-TOOL-2-88 |
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TOOL |
IC extraction tool | |
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