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IC307 Series
IC307 Series
0.8mm Pitch Production IC Sockets for FLGA
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Features

・Designed for surface mounting
・High contact reliability with gold plating
・One-touch IC insertion
・Complete with IC removal fixture
・Suitable for automated assembly
・RoHS compliant

 

 

Product Specifications

 

Product Specifications

Title

Requirement

Insulation Resistance

100M¥ØMin.

Withstanding Voltage

150V AC rms / minute

Contact Resistance

50£í¥ØMax.

Current Rating

0.5A

Operating Temperature

-55¡É to +85¡É

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Product NameList

Product Name

Applicable Package

Pitch

Number of Pins (Contacts)

PCB mounting method

Plating

Connector Types

Remarks

IC307-088-1000

LGA

0.8mm

88

SMT

Gold plating

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FUJITSU DEVICES INC. NVPROM MSP88LV020

IC307-088-1001

LGA

0.8mm

88

SMT

Gold plating

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FUJITSU DEVICES INC. NVPROM MSP88LV020

IC307-TOOL-1-88

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TOOL

IC insertion tool

IC307-TOOL-2-88

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TOOL

IC extraction tool

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